Heatsink Recommendations

• We recommend that solid state relay modules be mounted to a heatsink sufficient to maintain the module’s base temperature at less than 85°C

under worst case ambient temperature and load conditions.

• The heatsink mounting surface should be a smooth (30-40 micro-inch finish), flat (30-40 micro-inch flatness across mating area), un-painted

surface which is clean and free of oxidation.

• An even coating of thermal compound (Dow Corning DC340 or equivalent) should be applied to both the heatsink and module mounting

surfaces and spread to a uniform depth of .002” to eliminate all air pockets.

• The module should be mounted to the heatsink using two #8 screws.

Thermal Pad

Product Code : SSR-ACC-TH-003

Part Number : 2323803-2

Operating Diagrams

* Overall height dimensions includes with clear cover

Dimensions in mm

Outline Dimensions

Product Code

Part Number

SSR3T-480A10

2345984-1

SSR3T-480A16

2345984-2

SSR3T-480A25

2345984-5

SSR3T-480A40

2345984-6

SSR3S-480A40

2345984-7

SSR3S-480A50

2345984-8

SSR3S-480A75

2345984-9

SSR3T-480D10

1-2345984-1

SSR3T-480D16

1-2345984-2

SSR3T-480D25

1-2345984-3

SSR3T-480D40

1-2345984-4

SSR3S-480D40

1-2345984-5

SSR3S-480D50

1-2345984-6

SSR3S-480D75

1-2345984-7

SSR3T-480D10R

1-2345984-9

SSR3T-480D25R

2-2345984-0

SSR3S-480D40R

2-2345984-1

SSR3S-480D50R

2-2345984-2

Screw details

SOLID STATE RELAY

02-2021, Rev. 0221

www.te.com

© 2015 Tyco Electronics Corporation,

a TE Connectivity Ltd. company

Datasheets and product specification

according to IEC 61810-1 and to be used

only together with the ‘Definitions’ section.

Datasheets and product data is subject to the

terms of the disclaimer and all chapters of

the ‘Definitions’ section, available at

http://relays.te.com/definitions

Datasheets, product data, ‘Definitions’ sec-

tion, application notes and all specifications

are subject to change.

3

Potter & Brumfield