VL53L1 datasheet(33/39 Pages) STMICROELECTRONICS

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VL53L1

Packaging and labeling

8.5

Pb-free solder reflow process

Figure 23 and Table shows the recommended and maximum values for the solder profile.

Customers have to tune the reflow profile depending on the PCB, solder paste and material

used. We expect customers to follow the “recommended” reflow profile, which is specifically

tuned for VL53L1 package.

For any reason, if a customer must perform a reflow profile which is different from the

“recommended” one (especially peak >240 °C), this new profile must be qualified by the

customer at their own risk. In any case, the profile have to be within the “maximum” profile

limit described in Table 19.

Figure 23. Solder profile

Note:

Temperature mentioned in Table 19 is measured at the top of the VL53L1 package.

Note:

The component should be limited to a maximum of three passes through this solder profile.

Note:

As the VL53L1 package is not sealed, only a dry reflow process should be used (such as

convection reflow). Vapor phase reflow is not suitable for the VL53L1 because it is an optical

component. Consequently, the VL53L1 should be treated carefully. This would typically

include using a ‘no-wash’ assembly process.

Table 19. Recommended solder profile

Parameters

Recommended

Maximum

Units

Minimum temperature (TS min)

Maximum temperature (TS max)

Time ts (TS min to TS max)

130

200

90-110

150

200

60 - 120

°C

Temperature (TL)

Time (tL)

Ramp up

217

55-65

217

55 - 65

°C

°C/s

Temperature (Tp-10)

Time (tp-10)

Ramp up

235

°C

°C/s

Peak temperature (Tp)

240

245

°C

Time to peak

300

Ramp down (peak to TL)-4

-6

°C/s

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