LSM6DSV16XTR datasheet(3/196 Pages) STMICROELECTRONICS

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Overview

The LSM6DSV16X is a system-in-package featuring a high-performance 3-axis digital accelerometer and 3-axis

digital gyroscope.

The LSM6DSV16X delivers best-in-class motion sensing that can detect orientation and gestures in order to

empower application developers and consumers with features and capabilities that are more sophisticated than

simply orienting their devices to portrait and landscape mode.

The event-detection interrupts enable efficient and reliable motion tracking and contextual awareness,

implementing hardware recognition of free-fall events, 6D orientation, click and double-click sensing, activity or

inactivity, stationary/motion detection and wake-up events. Machine learning and finite state machine processing

allows moving some algorithms from the application processor to the LSM6DSV16X sensor, enabling consistent

reduction of power consumption.

The LSM6DSV16X supports main OS requirements, offering real, virtual, and batch mode sensors. In addition,

the LSM6DSV16X can efficiently run the sensor-related features specified in Android, saving power and enabling

faster reaction time. In particular, the LSM6DSV16X has been designed to implement hardware features such as

significant motion detection, stationary/motion detection, tilt, pedometer functions, timestamping and to support

the data acquisition of external sensors.

The LSM6DSV16X offers hardware flexibility to connect the pins with different mode connections to external

sensors to expand functionalities such as adding a sensor hub, auxiliary SPI, and so forth.

The LSM6DSV16X offers advanced design flexibility for OIS and EIS applications. Both channels have a

dedicated processing path with independent filtering and enhanced EIS channel gyroscope data are read over the

primary interfaces I²C/ MIPI I3C® v1.1 / SPI.

Core 1 has been designed for user interface data processing for motion tracking. Data are available on the

primary output of I²C / SPI / I3C® for the accelerometer and gyroscope with independent ODR and FS.

Core 2 has been designed for OIS applications. Data are available on the aux SPI at 7.68 kHz with

accelerometer/gyroscope processing with independent FS at ±2 g - ±16 g (accelerometer) / ±125 dps - ±2000

dps (gyroscope). The accelerometer is also available as standalone with dedicated filtering.

Core 3 has been design for enhanced EIS. Data are available in freerun mode in the output registers or in FIFO

with dedicated tag and timestamp.

Up to 4.5 KB of FIFO with compression and dynamic allocation of significant data (that is, external sensors,

timestamp, and so forth) allows overall power saving of the system.

The LSM6DSV16X embeds a sensor fusion low-power algorithm able to provide a 6-axis (accelerometer +

gyroscope) game rotation vector represented as a quaternion. The X, Y, Z quaternion components are stored in

FIFO.

Like the entire portfolio of MEMS sensor modules, the LSM6DSV16X leverages the robust and mature in-house

manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The

various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces

are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed to better

match the characteristics of the sensing element.

The LSM6DSV16X embeds an analog hub, which is able to connect an external analog input and convert it to a

digital signal for processing as well as advanced dedicated features like a finite state machine and data filtering

for OIS, EIS, and motion processing.

The LSM6DSV16X embeds Qvar functionality, which is an electrostatic sensor able to measure the variation of

the quasi-electrostatic potential. The Qvar sensing channel can be used for user interface applications like tap,

double-tap, triple-tap, long press, and L/R – R/L swipe.

The LSM6DSV16X is available in a small plastic land grid array (LGA) package of 2.5 x 3.0 x 0.83 mm to address

ultra-compact solutions.

LSM6DSV16X

Overview

DS13510 - Rev 1

page 3/196

LSM6DSV16XTR Datasheet(PDF) 3 Page - STMicroelectronics

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