Traditional, Coplanar and

Direct Mate Orthogonal

ExaMAX® High-Speed Backplane System

• Meets a variety of industry specifications

• Exceeds OIF CEI-28G-LR specification for 28 Gbps standards

• 24 - 72 pair designs (4 and 6 pairs; 6, 8, 10 and 12 columns)

• Wafer design increases isolation for reduced crosstalk

• Press-fit tails provide a reliable electrical connection

ExaMAX® High-Speed Backplane Cable Assemblies

• 30 & 34 AWG Eye Speed® Ultra Low Skew Twinax Cable offers

improved signal integrity, increased flexibility and routability

• Highly customizable with modular flexibility

• Reduce costs due to lower layer counts

• Multiple end options available

KEY SPECIFICATIONS

FEATURES & BENEFITS

PITCH

INSULATOR MATERIAL

CONTACT MATERIAL

PLATING

OPERATING TEMP RANGE

CURRENT

RATING

2.00 mm

LCP

Zinc Alloy (EGBX Series only)

Copper Alloy

Sn over 50 µ"

(1.27 µm) Ni

-55 °C to +105 °C

4.2 A per pin

HIGH-SPEEDBACKPLANE

CONNECTOR&CABLESYSTEMS

Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.

Staggered

Differential Pair Design

Two Reliable Points of

Contact at All Times

Intermateable with all

ExaMAX® Connectors

Wafer Design

Reduces Crosstalk

(2.00 mm) .0787" PITCH

F-221 (Rev 30SEP21)

samtec.com/ExaMAX