VOT8024AM

www.vishay.com

Vishay Semiconductors

Rev. 1.2, 26-Oct-2018

9

Document Number: 84909

For technical questions, contact: optocoupleranswers@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

SOLDER PROFILES

IR Reflow Soldering (JEDEC® J-STD-020C compliant)

One time soldering reflow is recommended within the

condition of temperature and time profile shown below. Do

not solder more than three times.

Fig. 2

Wave Soldering (JEDEC JESD22-A111 compliant)

One time soldering is recommended within the condition of

temperature.

Temperature: 260 °C + 0 °C / - 5 °C

Time: 10 s

Preheat temperature: 25 °C to 140 °C

Preheat time: 30 s to 80 s

Fig. 3

Hand Soldering by Soldering Iron

Allow single lead soldering in every single process. One time

soldering is recommended.

Temperature: 380 °C + 0 °C / - 5 °C

Time: 3 s max.

HANDLING AND STORAGE CONDITIONS

ESD level: HBM class 2

Floor life: unlimited

Conditions: Tamb < 30 °C, RH < 85 %

Moisture sensitivity level 1, according to J-STD-020

PROFILE ITEM

CONDITIONS

Preheat

- Temperature minimum (TS min.)

150 °C

- Temperature maximum (TS max.)

200 °C

- Time (min. to max.) (tS)

90 s ± 30 s

Soldering zone

- Temperature (TL)

217 °C

- Time (tL)

60 s

Peak temperature (Tp)

260 °C

Ramp-up rate

3 °C/s max.

Ramp-down rate

3 °C/s to 6 °C/s

0

20406080

1000

10000

25

100

1000

10000

Time (s)

Axis Title

Time (s)

10

100

60 s

tL (soldering)

60 s to 120 s

tS (preheat)

35 s to 70 s

20 s

Tp (260 °C)

TL (217 °C)

TS max. (200 °C)

TS min.

(150 °C)

Ramp-up

Ramp-down

23016

10

100

1000

10000

0

200

250

300

0

0.5

2.5

3.0

3.5

4.0

Axis Title

Time (min)

150

100

50

2.0

1.0

1.5

260 °C + 0 °C / - 5 °C

wave temperature

Second wave

-5 °C/s

+200 °C/s

+2 °C/s

First wave

Preheat zone

23017