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SRP2010TMA-R24M Datasheet(PDF) 1 Page - Bourns Electronic Solutions

Part # SRP2010TMA-R24M
Description  SRP2010TMA Series - Shielded Power Inductors
PDF  4 Pages
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Manufacturer  BOURNS [Bourns Electronic Solutions]
Direct Link  http://www.bourns.com
Logo BOURNS - Bourns Electronic Solutions

SRP2010TMA-R24M Datasheet(HTML) 1 Page - Bourns Electronic Solutions

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SRP2010TMA Series - Shielded Power Inductors
Features
n
Compact size
n
Shielded construction for low radiation
n
Metal alloy powder core for high
saturation current
n
Flat wire
n
Low DCR
n
Wide range of operating temperatures
n
AEC-Q200 compliant
n
RoHS compliant* and halogen free**
Electrical Specifications @ 25 °C
Bourns Part No.
Inductance
@ 1 MHz / 1 V
Q
1 MHz
Typ.
SRF
(MHz)
Typ.
DCR
(mW)
Typ.
DCR
(mW)
Max.
Irms
(A)
Typ.
Isat
(A)
Typ.
L (mH) Tol. %
SRP2010TMA-R24M
0.24
20
15
130
18
20.5
6.5
7.7
SRP2010TMA-R33M
0.33
20
15
112
21
26
5.7
7.0
SRP2010TMA-R47M
0.47
20
15
82
28
32
5.3
6.0
SRP2010TMA-R56M
0.56
20
15
80
31
37.2
4.6
5.2
SRP2010TMA-R68M
0.68
20
15
78
44
50
4.0
5.0
SRP2010TMA-1R0M
1.00
20
15
60
49
59
3.6
4.4
SRP2010TMA-1R5M
1.50
20
15
52
80
96
2.6
3.0
SRP2010TMA-2R2M
2.20
20
15
42
130
150
2.3
2.65
Additional Information
Click these links for more information:
PRODUCT
SELECTOR
TECHNICAL
LIBRARY
INVENTORY SAMPLES
CONTACT
General Specifications
Operating Temperature
.................................. -55 °C to +150 °C
(Temperature rise included)
Storage Temperature (Component)
...................................... -55 °C to +150 °C
Temperature Rise ... 40 °C at rated Irms1
Rated Current
............. Inductance drops 30 % at Isat
Moisture Sensitivity Level......................1
ESD Classification (HBM)..................N/A
1 Circuit design, component, PCB trace size and
thickness, airflow and other cooling provisions
all affect the part temperature. Part temperature
should be verified in the end application.
Materials
Core...........................Metal alloy powder
Wire .............................Enameled copper
Terminal Finish ...............................Ni/Sn
Packaging........ 2000 pcs. per 7-inch reel
Electrical Schematic
How to Order
SRP2010TMA - 1R0M
Model
Value Code (see table)
Soldering Profile
25
260
Time (Seconds)
REFLOW TIMES: 3 TIMES MAX.
PREHEAT AREA
MAX. RAMP UP RATE = 3 °C/SEC.
MAX. RAMP DOWN RATE = 6 °C/SEC.
Time 25 °C to Peak
8 Minutes Max.
TC -5 °C
200 °C
60~150
Sec.
217
150°C
60~120
Sec.
< 30 Sec.
Profile Feature
Pb Free Assembly
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time(ts) from Tsmin to Tsmax
150 °C
200 °C
60-120 seconds
Ramp-up Rate (TL to Tp)
3 °C/second max.
Liquidous temperature (TL)
Time (tL) maintained above TL
217 °C
60-150 seconds
Peak package body temperature (Tp)
260 °C
Time within 5 °C of Actual Peak Temperature
(tp)
< 30 seconds
Ramp-Down Rate (Tp to TL)
6 °C/second max.
Time 25 °C to Peak Temperature
8 minutes max.
Specifications are subject to change without notice. Users should
verify actual device performance in their specific applications.
The products described herein and this document are subject
to specific legal disclaimers as set forth on the last page of this
document, and at www.bourns.com/docs/legal/disclaimer.pdf.
* RoHS Directive 2015/863, Mar 31, 2015 and Annex.
** Bourns considers a product to be “halogen free” if
(a) the Bromine (Br) content is 900 ppm or less; (b)
the Chlorine (Cl) content is 900 ppm or less; and (c)
the total Bromine (Br) and Chlorine (Cl) content is
1500 ppm or less.
WARNING
Cancer and Reproductive Harm
www.P65Warnings.ca.gov
Product Dimensions
BOTTOM VIEW
SIDE VIEW
SIDE VIEW
2.0 ± 0.3
(.079 ± .012)
0.7 ± 0.3
(.028 ± .012)
0.8 ± 0.2
(.031 ± .008)
1.6 ± 0.3
(.063 ± .012)
DIMENSIONS:
MM
(INCHES)
Recommended Layout
2.5
(.098)
0.5
(.020)
1.9
(.075)


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