VS-104MT..KPbF Series

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Vishay Semiconductors

Revision: 14-Sep-17

3

Document Number: 94351

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Note

• Table shows the increment of thermal resistance RthJC when devices operate at different conduction angles than DC

Fig. 1 - Current Ratings Characteristic

Fig. 2 - Forward Voltage Drop Characteristics

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum junction operating



and storage temperature range

TJ, TStg

-40 to +125

°C

Maximum thermal resistance,



junction to case

RthJC

DC operation per single AC switch

0.34

K/W

DC operation per junction

0.69

180 °C sine conduction angle per single AC switch

0.36

180 °C sine conduction angle per junction

0.72

Maximum thermal resistance,



case to heat sink

RthCS

Per module



Mounting surface smooth, flat and greased

0.03

Mounting



torque ± 100 %

to heat sink

A mounting compound is recommended and the torque

should be rechecked after a period of 3 hours to allow for

the spread of the compound. Lubricated threads.

4 to 6

Nm

to terminal

3 to 4

Approximate weight

225

g

R CONDUCTION PER JUNCTION

DEVICES

SINUSOIDAL CONDUCTION

AT TJ MAXIMUM

RECTANGULAR CONDUCTION

AT TJ MAXIMUM

UNITS

180°

120°

90°

60°

30°

180°

120°

90°

60°

30°

104MT.K

0.027

0.033

0.042

0.057

0.081

0.023

0.037

0.046

0.059

0.082

K/W

90

80

70

60

120

130

100

110

RMS Output Current (A)

20

40

100

120

60

80

0

104MT..K Series

Device fully turned-on

Per single AC switch

For all conduction angles

I

RMS

~

1

100

10

1000

Instantaneous On-State Voltage (V)

1234

5

0

T

J = 25 °C

104MT..K Series

Per junction

T

J = 125 °C