APT40GP60B_S

DYNAMIC CHARACTERISTICS

Symbol

SSOA

Test Conditions

Capacitance

f = 1 MHz

Gate Charge

Inductive Switching (25°C)

Inductive Switching (125°C)

Characteristic

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Gate-to-Emitter Plateau Voltage

Gate-Emitter Charge

Gate-Collector ("Miller ") Charge

Switching SOA

Turn-on Delay Time

Current Rise Time

Turn-off Delay Time

Current Fall Time

Turn-on Delay Time

Current Rise Time

Turn-off Delay Time

Current Fall Time

MIN

TYP

MAX

4610

395

25

7.5

135

30

40

160

20

29

64

45

385

644

352

450

20

29

89

69

385

972

615

950

UNIT

pF

V

nC

A

ns

ns

UNIT

°C/W

gm

MIN

TYP

MAX

.23

N/A

5.90

Characteristic

Junction to Case (IGBT)

Junction to Case (DIODE)

Package Weight

Symbol

THERMAL AND MECHANICAL CHARACTERISTICS

1 Repetitive Rating: Pulse width limited by maximum junction temperature.

2 For Combi devices, I

ces

includes both IGBT and FRED leakages

3 See MIL-STD-750 Method 3471.

4E

on1

is the clamped inductive turn-on-energy of the IGBT only, without the effect of a commutating diode reverse recovery current

adding to the IGBT turn-on loss. (See Figure24.)

5E

on2

is the clamped inductive turn-on energy that includes a commutating diode reverse recovery current in the IGBT turn-on switching

loss. A Combi device is used for the clamping diode as shown in the E

on2

test circuit. (See Figures 21, 22.)

6E

off

is the clamped inductive turn-off energy measured in accordance wtih JEDEC standard JESD24-1. (See Figures 21, 23.)

7 Continuous current limited by package lead temperature.

APT Reserves the right to change, without notice, the specifications and information contained herein.