5

D.FL75 Series●75Ω Micro Coaxial Connector Supporting 12G-SDI

BUsage Precautions

 1. Plugs

(1) Mating/Unmating

1. To disconnect the connector, insert the extraction tool (D.FL75-LP-N) under the

connector flange. Pull in a perpendicular direction in line with the connector's mating axis.

Do not unmate the plug by pulling on the cable, this can damage the connector

performance.

2. When mating, align the mating axes between the receptacle and cable assembly, and

insert the cable assembly downward and perpendicular into the receptacle.

Do not insert the cable assembly at a slanted angle.

(2) Tolerable load to a cable

after mating

Once the connector has been mated do not apply forces exceeding the values in the

diagram below.

(3) Precautions

Do not use excessive prying form to mate or un-mate the connectors as it may lead to damage.

 2. Receptacles

(1) Recommended reflow

temperature profile

(reference)

1. The temperatures indicated are the surface temperatures of the printed circuit board

near the terminal contact points.

2. Reflow soldering should be performed on the surface of the printed circuit board at a

max temperature of 250

℃ or less.

3. Temperature profile may vary due to external mounting conditions such as solder

paste, manufacturer, PCB size and other soldering materials.

(2) Recommended metal mask

thickness

0.1mm-0.12mm

(3) Reflow cycles

Maximum of 2 cycles

 3. Operating Environment and Storage Conditions

(1) Operation environment

This product was designed assuming use in a normal environment. Please be advised

that using this product in the environments described below may result in discoloration

and other types of degradation.

・Exposure to excessive amounts of fine particles and dust.

・Regions/ areas with a high concentration of gases like sulfur dioxide, hydrogen sulfide

and nitrogen dioxide.

・Areas with drastic temperature change, such as locations near a heater.

(2) Storage conditions

Store this product in Hirose's packaging or similar conditions.

Temperature : -10 to +40

℃ Humidity : 85% or less (recommended storage conditions)

We recommend the product be used within six months from delivery.

Products that have been stored beyond the recommended storage period need to be

tested for mounting and solderability before use.

3.9N max.

1N max.

1N max.

D.FL75-R-SMT-1

D.FL75-LP(P)-084

Lead-free paste solder temperature profile (reference)

260

240

220

200

180

160

140

120

100

80

0

130

℃

180

℃

230

℃

below 250

℃

less than 10 seconds

less than

120 seconds

less than 50 sec.

less than 60 sec.

Soldering time

Time (sec.)

Preheating time

220

℃