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TLP3549 Datasheet(PDF) 1 Page - Toshiba Semiconductor |
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TLP3549 Datasheet(HTML) 1 Page - Toshiba Semiconductor |
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1 / 20 page ![]() TLP3549,TLP3549F 1 Photocouplers Photorelay TLP3549,TLP3549F TLP3549,TLP3549F TLP3549,TLP3549F TLP3549,TLP3549F Start of commercial production 2016-05 1. 1. 1. 1. Applications Applications Applications Applications • Mechanical relay replacements • Factory Automation (FA) • Programmable Logic Controllers (PLCs) • Measuring Instruments • ATE (Automatic Test Equipment) 2. 2. 2. 2. General General General General The TLP3549 and TLP3549F photorelay consist of a photo MOSFET optically coupled to an infrared LED. It is housed in a 8-pin DIP package. The low ON-state resistance and the high permissible ON-state current of the TLP3549 and TLP3549F make it suitable for power line control applications. 3. 3. 3. 3. Features Features Features Features (1) Normally opened (1-Form-A) (2) OFF-state output terminal voltage: 600 V (min) (3) Trigger LED current: 5.0 mA (max) (4) ON-state current: 0.6 A (max) (A connection) (5) ON-state resistance: 2 Ω (max) (A connection) (6) Isolation voltage: 2500 Vrms (min) (7) Safety standards UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 UL-recognized: UL 508, File No.E499232 (Note 1) (Note 1) (Note 1) (Note 1) VDE-approved: EN 60747-5-5 (Note 2) (Note 2) (Note 2) (Note 2) Note 1: Please refer Absolute Maximum Ratings (UL-recognized UL 508) for UL 508 products. Note 2: When a VDE approved type is needed, please designate the Option (D4) Option (D4) Option (D4) Option (D4). 4. 4. 4. 4. Mechanical Parameters Mechanical Parameters Mechanical Parameters Mechanical Parameters Characteristics Creepage distances Clearance distances Internal isolation thickness 7.62-mm Pitch TLP3549 7.0 (min) 7.0 (min) 0.4 (min) 10.16-mm Pitch TLP3549F 8.0 (min) 8.0 (min) 0.4 (min) Unit mm 2019-11-14 Rev.5.0 ©2016-2019 Toshiba Electronic Devices & Storage Corporation |
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