Nexperia

BCP55 series

60 V, 1 A NPN medium power transistors

9. Thermal characteristics

Table 7. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1]

-

-

192

K/W

[2]

-

-

125

K/W

Rth(j-a)

thermal resistance from junction to ambient

in free air

[3]

-

-

93

K/W

Rth(j-sp)

thermal resistance from junction to solder point

-

-

16

K/W

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated; monting pad for collector 1 cm2.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated; monting pad for collector 6 cm2.

006aac677

10

1

102

103

Zth(j-a)

(K/W)

10- 1

10- 5

10

10- 2

10- 4

102

10- 1

tp (s)

10- 3

103

1

0

duty cycle = 1

0.01

0.02

0.05

0.1

0.2

0.33

0.5

0.75

FR4 PCB, single-sided, tin-plated and standard footprint

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

006aac678

10

1

102

103

Zth(j-a)

(K/W)

10- 1

10- 5

10

10- 2

10- 4

102

10- 1

tp (s)

10- 3

103

1

0

duty cycle = 1

0.01

0.02

0.05

0.1

0.2

0.33

0.5

0.75

FR4 PCB, single-sided copper, tin-plated; mounting pad for collector 1 cm2.

Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

BCP55_SER

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Product data sheet

Rev. 9 — 1 July 2022

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