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STM32H7B0IB Datasheet(PDF) 177 Page - STMicroelectronics |
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STM32H7B0IB Datasheet(HTML) 177 Page - STMicroelectronics |
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177 / 205 page  Table 128. LQFP144 - Mechanical data Symbol millimeters inches(14.) Min Typ Max Min Typ Max A - - 1.60 - - 0.0630 A1(12.) 0.05 - 0.15 0.0020 - 0.0059 A2 1.35 1.40 1.45 0.0531 0.0551 0.0571 b(9.)(11.) 0.17 0.22 0.27 0.0067 0.0087 0.0106 b1(11.) 0.17 0.20 0.23 0.0067 0.0079 0.0090 c(11.) 0.09 - 0.20 0.0035 - 0.0079 c1(11.) 0.09 - 0.16 0.0035 - 0.0063 D(4.) 22.00 BSC 0.8661 BSC D1(2.)(5.) 20.00 BSC 0.7874 BSC E(4.) 22.00 BSC 0.8661 BSC E1(2.)(5.) 20.00 BSC 0.7874 BSC e 0.50 BSC 0.0197 BSC L 0.45 0.60 0.75 0.0177 0.0236 0.0295 L1 1.00 REF 0.0394 REF N(13.) 144 Θ 0° 3.5° 7° 0° 3.5° 7° Θ1 0° - - 0° - - Θ2 10° 12° 14° 10° 12° 14° Θ3 10° 12° 14° 10° 12° 14° R1 0.08 - - 0.0031 - - R2 0.08 - 0.20 0.0031 - 0.0079 S 0.20 - - 0.0079 - - aaa 0.20 0.0079 bbb 0.20 0.0079 ccc 0.08 0.0031 ddd 0.08 0.0031 Notes: 1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994. 2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm. 3. Datums A-B and D to be determined at datum plane H. 4. To be determined at seating datum plane C. 5. Dimensions D1and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size dimensions including mold mismatch. 6. Details of pin 1 identifier are optional but must be located within the zone indicated. 7. All dimensions are in millimeters. 8. No intrusion allowed inwards the leads. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages. STM32H7B0xB LQFP144 package information DS13196 - Rev 7 page 177/205 |
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