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SL2ICS50 Datasheet(PDF) 4 Page - NXP Semiconductors |
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SL2ICS50 Datasheet(HTML) 4 Page - NXP Semiconductors |
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4 / 28 page  136430 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 3.0 — 14 March 2007 4 of 28 NXP Semiconductors SL2 ICS50/SL2 ICS51 I•CODE SLI-L/I•CODE SLI-L HC PUBLIC Table 1: Quick reference data Symbol Description Min Typ[1] Max Unit SL2 ICS50 I•CODE SLI- L 23.5 pF SL2 ICS51 I•CODE SLI- L HC 97.0 pf [1] Typical values are not guaranteed. These values listed are at room temperature. 5. Ordering information Table 2: Ordering information Type number Package Name Description Version SL2 ICS5001EW/V1 FFC sawn wafer 150 µm on film frame carrier - SL2 FCS5001 EV/DH FCP Flip Chip Package - SL2 MOS5001EV MOA2 Module for contactless chip card ICs PLMCC-05 SOT500AA1 SL2 ICS5101EW/V1 FFC sawn wafer 150 µm on film frame carrier - SL2 FCS5101 EV/DH FCP Flip Chip Package - SL2 MOS5101EV MOA2 Module for contactless chip card ICs PLMCC-05 SOT500AA1 |
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