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74LVC2G74DP Datasheet(PDF) 2 Page - NXP Semiconductors

Part # 74LVC2G74DP
Description  Single D-type flip-flop with set and reset; positive edge trigger
PDF  20 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74LVC2G74DP Datasheet(HTML) 2 Page - NXP Semiconductors

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74LVC2G74_1
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 3 November 2005
2 of 20
Philips Semiconductors
74LVC2G74
Single D-type flip-flop with set and reset; positive edge trigger
3.
Quick reference data
[1]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD =CPD × VCC2 × fi × N+ Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(C
L × VCC
2
× f
o) = sum of the outputs.
[2]
The condition is VI = GND to VCC.
4.
Ordering information
5.
Marking
Table 1:
Quick reference data
GND = 0 V; Tamb =25 °C; tr =tf ≤ 2.5 ns.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tPHL, tPLH propagation delay
CP to Q, QCL = 50 pF; VCC = 3.3 V
-
3.5
-
ns
SD to Q, QCL = 50 pF; VCC = 3.3 V
-
3.0
-
ns
RD to Q, QCL = 50 pF; VCC = 3.3 V
-
3.0
-
ns
fmax
maximum input clock
frequency
CL = 50 pF; VCC = 3.3 V
-
280
-
MHz
Ci
input capacitance
-
4.0
-
pF
CPD
power dissipation
capacitance
VCC = 3.3 V
[1] [2] -15
-
pF
Table 2:
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVC2G74DP
−40 °C to +125 °C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
74LVC2G74DC
−40 °C to +125 °C
VSSOP8
plastic very thin shrink small outline package;
8 leads; body width 2.3 mm
SOT765-1
74LVC2G74GT
−40 °C to +125 °C
XSON8
plastic extremely thin small outline package;
no leads; 8 terminals; body 1
× 1.95 × 0.5 mm
SOT833-1
Table 3:
Marking
Type number
Marking code
74LVC2G74DP
V74
74LVC2G74DC
V74
74LVC2G74GT
V74



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