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HC5503PRCBZ Datasheet(PDF) 1 Page - Renesas Technology Corp

Part # HC5503PRCBZ
Description  Low Cost SLIC For Large Telecom Switches
PDF  11 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

HC5503PRCBZ Datasheet(HTML) 1 Page - Renesas Technology Corp

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FN4806 Rev.3.00
Page 1 of 11
June 2004
FN4806
Rev.3.00
June 2004
HC5503PRC
Low Cost SLIC For Large Telecom Switches
DATASHEET
The HC5503PRC is a low cost SLIC optimized for large
Telecom switches. It combines a flexible voltage feed
architecture with the Intersil latch-free DI bonded wafer
process, to provide a low component count, carrier class
solution at very low cost. The re-configurable design permits
simple, economical solutions for campus-wide call center
and PBX applications. External components can be used in
conjunction with the high battery voltage capability to meet
the complex impedance and long loop drive requirements of
Central Office switches, worldwide.
Features
• Wide Operating Battery Range (-40V to -58V)
• Single Additional +5V Supply
• 30mA Short Loop Current Limit
• Ring Relay Driver
• Switch Hook and Ring Trip Detect
• Low On-Hook Power Consumption
• On-Hook Transmission
• ITU-T Longitudinal Balance Performance
• Loop Power Denial Function
• Thermal Protection
• Supports Tip, Ring or Balanced Ringing Schemes
• Low Profile SO and QFN Surface Mount Packaging
• Pb-free Available
Applications
• Central Office, PBX, Call Centers
• Related Literature
- AN571, Using Ring Sync with HC-5502A and HC-5504
SLICs
Ordering Information
PART NUMBER
TEMP.
RANGE (°C)
PACKAGE
PKG.
DWG. #
HC5503PRCB
0 to 70
24 Ld SOIC
M24.3
HC5503PRCBZ
(Note)
0 to 70
24 Ld SOIC (Pb-free)
M24.3
HC5503PRCBZ96
(Note)
0 to 70
24 Ld SOIC Tape & Reel
(Pb-free)
M24.3
HC5503PRCR
0 to 70
32 Ld 7x7 QFN
L32.7x7
HC5503PRCRZ
(Note)
0 to 70
32 Ld 7x7 QFN
(Pb-free)
L32.7x7
HC5503PRCRZ96
(Note)
0 to 70
32 Ld 7x7 QFN
Tape & Reel (Pb-free)
L32.7x7
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.


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