ISL8200MM

FN7690 Rev 2.00

Page 21 of 24

Mar 15, 2013

Revision History

The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you

have the latest revision.

DATE

REVISION

CHANGE

February 1, 2013

FN7690.2

page 1: Sentence added to fourth paragraph: “For example, parallel 2 for 20A and up to 6 for 60A. The output

voltage can be precisely regulated to as low as 0.6V with ±1% output voltage regulation over line, load, and

temperature variations.”

Pin Descriptions table

page 3: Vout_Set: Changed “500” to “600”

page 4:

FF: Changed “The voltages on” to “the voltage on”

Changed “Voltage Input 0.7 to Vcc” to "The input voltage range is 0.8V to Vcc."

VIN: Changed "remained" to "remaining"

Changed “Input Voltage Range 0V to 20V” to “The input voltage range is 4.5V to 20V.”

PVCC: Changed “3V” to “4.5V”

VCC: Changed “2.97V” to “4.5V”

page 5:

Phase Thermal Pad: Added “Connect this pad to a copper island on the PCB board with the same shape as the

PHASE thermal pad.”

PVIN Thermal Pad: Added “Connect this pad to a copper island on the PCB board with the same shape as the

PVIN thermal pad.”

PGND Thermal Pad: Added “Connect this pad to a copper island on the PCB board with the same shape as the

PGND thermal pad.”

VOUT Thermal Pad: Added “Connect this pad to a copper island on the PCB board with the same shape as the

Vout thermal pad.”

Recommended Operating Conditions, page 7

Input Voltage: Separated Vin and PVin into 2 lines

Driver Bias Voltage, PVCC . . . . . . . . . . 3V to 5.6V (Changed “3V to 5.6V” to “4.5V to 5.6V”)

Signal Bias Voltage, VCC . . . . . . . . . . . 3V to 5.6V (Changed “3V to 5.6V” to “4.5V to 5.6”)

Maximum Current (IPVCC) . . . . . . . . . . . 250mA (Changed from 250 to 320)

page 7, Electrical Spec table: Current (IPVCC) Changed TYP from 250 to 320

page 14, Input Supply Voltage section, 2nd paragraph added "it is recommended to add 0.5V to the result to

account for temperature variations."

Equation 2: Changed formula variable from “Vin” to “PVin”

page 16, Current Share section:

Changed "between ICs" to "between ICs, up to 3 phases"

page 16: Overcurrent Protection:

Changed: “In multi-module operation, by connecting modules’ ISHARE pin together, results in the VISHARE

representing the average current of all active channels.” to: "Multi-module operation can be achieved by

connecting the ISHARE pin of two or more modules together. In multi-module operation the voltage on the

ISHARE pin correlates to the average current of all active channels."

Changed: “The total system currents are compared with a precision 1.2V threshold to determine the overcurren

condition as well as each channel having additional overcurrent trip point at 108μA with 7-cycle delay.” to: "The

output current of each module in multi-module operation is compared to a precise 1.2V threshold to determine

the overcurrent condition. Additionally, each module has an overcurrent trip point of 108μA with 7-cycle delay."

page 20, Reflow Parameters, Changed the reflow profile (Figure 33) From:

PEAK TEMPERATURE +230°C~+245°C;

TYPICALLY 60s-70s ABOVE +220°C

KEEP LESS THAN 30s WITHIN 5°C OF PEAK TEMP.

SLOW RAMP (3°C/s MAX)

AND SOAK FROM +100°C

TO +180°C FOR 90s~120s

To:

PEAK TEMPERATURE +215°C~+220°C;

TYPICALLY 60s-70s ABOVE +183°C

KEEP LESS THAN 20s WITHIN 5°C OF PEAK TEMP.

SLOW RAMP (3°C/s MAX)

AND SOAK FROM +100°C

TO +150°C FOR 6

0s~120s

page 23, Package Outline Drawing updated from Rev 2 to Rev 3. Changes were: On page 2 in the "Typical

recommended land pattern", changed number in upper left pad from 22 to 23 since this package has 23 I/O

signal pads.