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AD12401/KIT Datasheet(PDF) 20 Page - Analog Devices |
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AD12401/KIT Datasheet(HTML) 20 Page - Analog Devices |
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20 / 28 page  AD12401 Rev. A | Page 20 of 28 GAIN SELECT The AD12401 is graded out for the gain mode and should be ordered accordingly: the AD12401-xxxKWS is calibrated in the low gain mode, and the AD12401-xxxJWS is calibrated in the high gain mode. Performance is not guaranteed if either grade is used in the wrong gain mode. The high gain mode sets the analog input voltage to approximately 1.6 V p-p. The low gain mode sets the analog input voltage to approximately 3.2 V p-p. For high gain mode, the user should pull Pin 103 (H/L_GAIN) up to 3.3 V using a 4.02 kΩ resistor. For low gain mode, the user should ground Pin 103. THERMAL CONSIDERATIONS The module is rated to operate over a case temperature of 0°C to 60°C. To maintain the tight channel matching and reliability of the AD12401, care must be taken to ensure that proper thermal and mechanical considerations have been made and addressed to ensure case temperature is kept within this range. Each application requires evaluation of the thermal manage- ment as applicable to the system design. This section provides information that should be used in the evaluation of the AD12401’s thermal management for each specific use. In addition to the radiation of heat into its environment, the AD12401 module enables the flow of heat through the mounting studs and standoffs as they contact the motherboard. As described in the Package Integrity/Mounting Guidelines section, the module should be secured to the motherboard using 2-56 nuts (washer use is optional). The torque on the nuts should not exceed 32-inch ounces. Using a thermal grease at the standoffs results in better thermal coupling between the board and module. Depending on the ambient conditions, airflow can be necessary to ensure the components in the module do not exceed their maximum operating temperature. For reliability, the most sensitive component has a maximum junction temperature rating of 125°C. Figure 22 and Figure 23 provide a basic guideline for two key thermal management decisions: the use of thermal interface material between the module bottom cover/mother board and airflow. Figure 21 characterizes the typical thermal profile of an AD12401 that is not using thermal interface material. Figure 22 provides the same information for a configuration that uses gap-filling thermal interface material. In this case, Thermagon T-flex 600 Series™, 0.040” thickness, was used. These profiles show that the maximum die temperature is reduced by approximately 2°C when thermal interface material is used. Figure 22 and Figure 23 also provide a guideline for determining the airflow requirements for given ambient conditions. For example, a goal of 120°C die temperature in a 40°C ambient environment without the use of thermal interface material requires an airflow of 100 LFM. From a channel-matching perspective, the most important consideration is external thermal influences. It is possible for thermal imbalances in the end application to adversely affect the dynamic performance. Due to the temperature dependence of the image spur, substantial deviation from the factory cali- bration conditions can have a detrimental effect. Unbalanced thermal influences can cause gradients across the module, and performance degradation can result. Examples of unbalanced thermal influences can include large heat dissipating elements near one side of the AD12401, or obstructed airflow that does not flow uniformly across the module. The thermal sensitivity of the module can be affected by a change in thermal gradient across the module of 2°C. AIRFLOW CONDITION 20 30 40 50 60 70 80 90 100 110 TYPICAL JUNCTION CASE AMBIENT NO AIRFLOW 100 LFM 300 LFM Figure 22. Typical Temperature vs. Airflow with No Module/Board Interface Material (Normalized to 60°C Module Case Temperature) TYPICAL JUNCTION CASE AMBIENT AIRFLOW CONDITION 20 30 40 50 60 70 80 90 100 110 NO AIRFLOW 100 LFM 300 LFM Figure 23. Typical Temperature vs. Airflow with T-flex Module/Board Interface Material (Normalized to 60°C Module Case Temperature Ambient) PACKAGE INTEGRITY/MOUNTING GUIDELINES The AD12401 is a printed circuit board (PCB)-based module designed to provide mechanical stability and to support the intricate channel-to-channel matching necessary to achieve high dynamic range performance. The module should be secured to the motherboard using 2-56 nuts (washer use is optional). The torque on the nuts should not exceed 32-inch ounces. |
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