DMTH8003STLWQ

Document number: DS42466 Rev. 3 - 2

2 of 7

www.diodes.com

July 2022

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DMTH8003STLWQ

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

VDSS

80

V

Gate-Source Voltage

VGSS

±20

V

Continuous Drain Current (Note 6) VGS = 10V

TC = +25°C

TC = +100°C

ID

173

122

A

Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)

IDM

692

A

Pulsed Body Diode Forward Current (10µs Pulse, Duty Cycle = 1%)

ISM

692

A

Maximum Continuous Body Diode Forward Current (Note 6)

IS

173

A

Avalanche Current, L = 0.3mH

IAS

73

A

Avalanche Energy, L = 0.3mH

EAS

800

mJ

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Total Power Dissipation (Note 5)

TA = +25°C

PD

5.6

W

Thermal Resistance, Junction to Ambient (Note 5)

RθJA

27

°C/W

Total Power Dissipation (Note 6)

TC = +25°C

PD

150

W

Thermal Resistance, Junction to Case (Note 6)

RθJC

1

°C/W

Operating and Storage Temperature Range

TJ, TSTG

-55 to +175

°C

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)

Drain-Source Breakdown Voltage

BVDSS

80

—

—

V

VGS = 0V, ID = 1mA

Zero Gate Voltage Drain Current

IDSS

—

—

1

µA

VDS = 64V, VGS = 0V

Gate-Source Leakage

IGSS

—

—

±100

nA

VGS = ±20V, VDS = 0V

ON CHARACTERISTICS (Note 7)

Gate Threshold Voltage

VGS(TH)

2

—

4

V

VDS = VGS, ID = 250µA

Static Drain-Source On-Resistance

RDS(ON)

—

1.42

2.5

m

Ω

VGS = 10V, ID = 30A

Diode Forward Voltage

VSD

—

0.8

1.2

V

VGS = 0V, IS = 30A

DYNAMIC CHARACTERISTICS (Note 8)

Input Capacitance

Ciss

—

8191

—

pF

VDS = 40V, VGS = 0V,

f = 1MHz

Output Capacitance

Coss

—

2905

—

Reverse Transfer Capacitance

Crss

—

120

—

Gate Resistance

Rg

—

1.1

—

Ω

VDS = 0V, VGS = 0V, f = 1MHz

Total Gate Charge

Qg

—

124

—

nC

VDS = 40V, ID = 30A, VGS = 10V

Gate-Source Charge

Qgs

—

37

—

Gate-Drain Charge

Qgd

—

32

—

Turn-On Delay Time

tD(ON)

—

33

—

ns

VDD = 40V, VGS = 10V,

ID = 30A, RG = 6Ω

Turn-On Rise Time

tR

—

45

—

Turn-Off Delay Time

tD(OFF)

—

80

—

Turn-Off Fall Time

tF

—

55

—

Body Diode Reverse Recovery Time

tRR

—

99

—

ns

IS = 25A, di/dt = 100A/μs

Body Diode Reverse Recovery Charge

QRR

—

243

—

nC

Notes:

5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.

6. Thermal resistance from junction to soldering point (on the exposed drain pad).

7. Short duration pulse test used to minimize self-heating effect.

8. Guaranteed by design. Not subject to product testing.