Specifications and information are subject to change without notice.

WJ Communications, Inc

• Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

Page 7 of 9 June 2005

AH312 / ECP200G

2 Watt, High Linearity InGaP HBT Amplifier

Product Information

AH312-S8 (SOIC-8 Package) Mechanical Information

This package may contain lead-bearing materials. The plating material on the leads is SnPb.

Outline Drawing

Land Pattern

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

° C

17.5

° C / W

155

° C

Notes:

1. The thermal resistance is referenced from the hottest part

of the junction to the ground slug underneath the device.

2. This corresponds to the typical biasing condition of

+5V, 800 mA at an 85

° C case temperature. A

minimum MTTF of 1 million hours is achieved for

junction temperatures below 247

° C. Tjc is a function

of the voltage at pins 6 and 7 and the current applied

to pins 6, 7, and 8 and can be calculated by:

Tjc = Tcase + Rth * Vcc * Icc

Product Marking

The component will be marked with an

“AH312-S8” designator with an alphanumeric

lot code on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

ESD / MSL Information

ESD Rating: Class 1B

Value:

Passes between 500 and 1000V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +235

° C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1. A heatsink underneath the area of the PCB for the mounted device

is strictly required for proper thermal operation. Damage to the

device can occur without the use of one.

2. Ground / thermal vias are critical for the proper performance of this

device. Vias should use a .35mm (#80 / .0135”) diameter drill and

have a final plated thru diameter of .25 mm (.010”).

3. Add as much copper as possible to inner and outer layers near the

part to ensure optimal thermal performance.

4. Mounting screws can be added near the part to fasten the board to a

heatsink. Ensure that the ground / thermal via region contacts the

heatsink.

5. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

6. RF trace width depends upon the PC board material and

construction.

7. Use 1 oz. Copper minimum.

8. All dimensions are in millimeters (inches). Angles are in degrees.

MTTF vs. GNDTab Temperature

100

1000

10000

100000

60

70

80

90

100

110

120

Tab Temperature (°C)