Pad Description

Pad Name

I/O

Internal

Connection

Function

VDD

¾¾

Positive power supply

VDDA

¾¾

DAC power supply

VSS

¾¾

Negative power supply, ground

VSSA

¾¾

DAC negative supply, ground

PA0~PA7

I/O

Wake-up,

Pull-high or

None

Bidirectional 8-bit I/O port, wake-up by mask option

PB0~PB7

I/O

Pull-high or

None

Bidirectional 8-bit I/O port

RESET

I

¾

Reset input, active low

OSC1

I

X

¢tal/Resistor XIN for X¢tal or ROSCIN for resistor by mask option

OSC2

O

¾

XOUT or T1

AUD

O

¾

DAC output interface

Absolute Maximum Ratings

Storage Temperature ..........................

-50°Cto125°C

Operating Temperature .........................

-25°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed

in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

Electrical Characteristics

Ta=25

°C

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Conditions

Operating Voltage

¾¾

2.4

4.5

5

V

Operating Current

3V

No load (OSC= 6MHz)

¾

28

mA

4.5V

¾

810

Standby Current

3V

¾

¾

1

¾

mA

4.5V

¾

13

Flag Source Current

3V

¾

5

¾¾

mA

4.5V

Flag Sink Current

3V

¾

5

¾¾

mA

4.5V

Input High Voltage for I/O Ports

¾¾

¾

V

Input Low Voltage for I/O Ports

¾¾

0

¾

V

HT3834

Rev. 1.00

3

November 2, 2006