HT6256

8

Helping You Control Your World

900202 Rev. B

4-98

ORDERING INFORMATION (1)

Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design. Honeywell does not assume any liability

arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.

(1) Orders may be faxed to 612-954-2257. Please contact our Customer Service Department at 612-954-2888 for further information.

To learn more about Honeywell Solid State Electronics Center,

visit our web site at http://www.ssec.honeywell.com

e

(pitch)

b

(width)

A

S1

b2

Q

L

S2

D

E

1

Right

Reading

on Lid

Ceramic

Body

A

b

b2

C

D

E

e

eA

L

Q

S1

S2

X

Y

Z

0.175 (max)

0.018 ± 0.002

0.050 (typ)

0.010 to 0.002

1.400 ± 0.014

0.594 ± 0.010

0.100 ±0.005

0.600 ±0.010

0.125 to 0.175

0.050 ±0.010

0.005 (min)

0.005 (min)

0.100 ref

0.050 ref

0.075 ref

All dimensions in inches

eA

C

Optional

Capacitors

Y

Z

X

HT6256DC

D - Indicates package type

D = 28-Lead DIP

For packaging options, call Honeywell

C - Indicates screening level

B = High Temperature Class B

C = Commercial

QUALITY ASSURANCE

Honeywell maintains a high level of product integrity through

process control utilizing statistical process control, a com-

plete “Total Quality Assurance System,” and a computer

data base process performance tracking system. This

Total Quality approach ensures our customers of a reliable

product by engineering in reliability, starting with process

development and continuing through product qualification

and screening.

SCREENING LEVELS

Honeywell offers several levels of device screening to

meet your system needs. Hi-Rel Level B devices undergo

additional screening per the requirements of MIL-STD-883.

RELIABILITY

Honeywell understands the stringent reliability require-

ments for extreme environment systems and has exten-

sive experience in reliability testing on programs of this

28-LEAD DIP PACKAGE

nature. Reliability attributes of the HTMOS process were

characterized by testing test structures from which specific

failure mechanisms were evaluated. These specific mecha-

nisms included, but were not limited to, hot carriers, electromi-

gration and time dependent dielectric breakdown. This data

was then used to make changes to the design models and

process to ensure reliable -55 to +225

°C specified products.

PACKAGING

The standard package is a hermetic 28-lead DIP con-

structed of multilayer ceramic (Al

power and ground planes. Ceramic chip capacitors can be

mounted to the package by the user to maximize supply

noise decoupling and increase board packing density.

These capacitors connect to the internal package power

and ground planes. This design minimizes resistance and

inductance of the bond wire and package. For packaging

options with surface mount capability or external control of

Chip Enable (CE), call Honeywell.