AD9992BBCZ datasheet(7/92 Pages) AD

7 / 92 page

AD9992

Rev. C | Page 7 of 92

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

With

Respect To

Rating

AVDD

AVSS

−0.2 V to +2.2 V

TCVDD

TCVSS

−0.2 V to +2.2 V

HVDD1/HVDD2

HVSS1/HVSS2

−0.3 V to +3.9 V

RGVDD

RGVSS

−0.3 V to +3.9 V

DVDD

DVSS

−0.2 V to +2.2 V

DRVDD

DRVSS

−0.3 V to +3.9 V

IOVDD

DVSS

−0.3 V to +3.9 V

XVVDD

DVSS

−0.3 V to +3.9 V

CLIVDD

TCVSS

−0.3 V to +3.9 V

CP1P8

CPVSS

−0.2 V to +2.2 V

RG Output

RGVSS

−0.3 V to RGVDD + 0.3 V

H1 to H8, HL Output

HVSS1/HVSS2

−0.3 V to HVDD + 0.3 V

Digital Outputs

DVSS

−0.3 V to IOVDD + 0.3 V

Digital Inputs

DVSS

−0.3 V to IOVDD + 0.3 V

SCK, SL, SDATA

DVSS

−0.3 V to IOVDD + 0.3 V

REFT, REFB, CCDIN

AVSS

−0.2 V to AVDD + 0.2 V

Junction Temperature

150°C

Lead Temperature,

10 sec

350°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 6. Thermal Resistance

Package Type

θJA

Unit

106-Lead CSP_BGA

40.3

°C/W

ESD CAUTION

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