CSTCC10.0MGA datasheet(141/153 Pages) STMICROELECTRONICS

141 / 153 page

ST72334J/N, ST72314J/N, ST72124J

141/153

PACKAGE MECHANICAL DATA (Cont’d)

Figure 102. 44-Pin Thin Quad Flat Package

Figure 103. 42-Pin Plastic Dual In-Line Package, Shrink 600-mil Width

Figure 104. THERMAL CHARACTERISTICS

Notes:

1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD)

Dim.

inches

Min

Typ

Max

Min

Typ

Max

1.60

0.063

0.05

0.15 0.002

0.006

1.35

1.40

1.45 0.053 0.055 0.057

0.30

0.37

0.45 0.012 0.015 0.018

0.09

0.20 0.004 0.000 0.008

12.00

0.472

10.00

0.394

12.00

0.472

10.00

0.394

0.80

0.031

0°

3.5°

7°

0°

3.5°

7°

0.45

0.60

0.75 0.018 0.024 0.030

1.00

0.039

Number of Pins

Dim.

inches

Min

Typ

Max

Min

Typ

Max

5.08

0.200

0.51

0.020

3.05

3.81

4.57 0.120 0.150 0.180

0.38

0.46

0.56 0.015 0.018 0.022

0.89

1.02

1.14 0.035 0.040 0.045

0.23

0.25

0.38 0.009 0.010 0.015

36.58 36.83 37.08 1.440 1.450 1.460

15.24

16.00 0.600

0.630

12.70 13.72 14.48 0.500 0.540 0.570

1.78

0.070

15.24

0.600

18.54

0.730

1.52 0.000

0.060

2.54

3.30

3.56 0.100 0.130 0.140

Number of Pins

0.015

GAGE PLANE

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