OPAX134 datasheet(9/15 Pages) TI

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OPA1632

SBOS286A − DECEMBER 2003 − REVISED SEPTEMBER 2006

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POWER DISSIPATION AND THERMAL

CONSIDERATIONS

The OPA1632 does not have thermal shutdown

protection. Take care to assure that the maximum

junction temperature is not exceeded. Excessive

junction temperature can degrade performance or

cause permanent damage. For best performance and

reliability, assure that the junction temperature does not

exceed +125

°C.

The thermal characteristics of the device are dictated

by the package and the circuit board. Maximum power

dissipation for a given package can be calculated using

the following formula:

Dmax

Tmax

* T

Where:

PDmax is the maximum power dissipation in the

amplifier (W).

Tmax

the

absolute

maximum

junction

temperature (

_C).

TA is the ambient temperature (_C).

qJA = qJC + qCA.

qJC is the thermal coefficient from the silicon

junctions to the case (

_C/W).

qCA is the thermal coefficient from the case to

ambient air (

_C/W).

For systems where heat dissipation is more critical, the

OPA1632 is offered in an MSOP-8 with PowerPAD.

The thermal coefficient for the MSOP PowerPAD

(DGN) package is substantially improved over the

traditional SO package. Maximum power dissipation

levels are depicted in Figure 5 for the two packages.

The data for the DGN package assumes a board layout

that follows the PowerPAD layout guidelines.

MAXIMUM POWER DISSIPATION

vs AMBIENT TEMPERATURE

−40

−15

Ambient Temperature (

_C)

3.5

3.0

2.5

2.0

1.5

1.0

0.5

JA = 170_ C/W for SO −8 (D)

JA = 58.4_ C/W for M SOP−8 (DGN )

J = 150_ C

No Airflow

SO−8 (D) Package

MSOP−8 (DGN) Package

Figure 5. Maximum Power Dissipation vs Ambient

Temperature

(1)

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