Preliminary Technical Data

ADA4937-1

Rev. PrA | Page 7 of 9

ABSOLUTE MAXIMUM RATINGS

quiescent power dissipation and the power dissipated in the

package due to the load drive. The quiescent power is the

voltage between the supply pins (V

Table 3.

Parameter

Rating

Supply Voltage

TBD

S

) times the quiescent

current (I

Power Dissipation

See Figure 2

S

). The power dissipated due to the load drive depends

upon the particular application. The power due to load drive is

calculated by multiplying the load current by the associated

voltage drop across the device. RMS voltages and currents must

be used in these calculations.

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +105°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Airflow increases heat dissipation, effectively reducing θ

Stresses above those listed under Absolute Maximum

Rating may cause permanent damage to the device. This is

a stress rating only; functional operation of the device at

these or any other conditions above those indicated in the

operational section of this specification is not implied.

Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

JA

. In

addition, more metal directly in contact with the package

leads/exposed pad from metal traces, through-holes, ground,

and power planes reduces the θ .

JA

Figure 2 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 16-lead LFCSP

(TBD °C/W) on a JEDEC standard 4-layer board.

THERMAL RESISTANCE

θ is specified for the worst-case conditions; that is, θ

JA

JA

is

specified for a device (including exposed pad) soldered to

the circuit board.

Table 4. Thermal Resistance

Package Type

θ

Unit

JA

16-Lead LFCSP (Exposed Pad)

TBD

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the ADA4937-1

package is limited by the associated rise in junction

is the glass transition temperature, the plastic changes its

properties. Even temporarily exceeding this temperature

limit can change the stresses that the package exerts on the

die, permanently shifting the parametric performance of

the ADA4937-1. Exceeding a junction temperature of 150°C

for an extended period can result in changes in the silicon

devices, potentially causing failure.

Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION