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ES9822PRO Datasheet(PDF) 112 Page - ESS Technology,Inc |
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ES9822PRO Datasheet(HTML) 112 Page - ESS Technology,Inc |
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112 / 126 page ![]() 0.3 ES9822 PRO Product Datasheet ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-8800 WWW.ESSTECH.COM 112 Reflow Process Considerations Temperature Controlled For lead-free soldering, the characterization and optimization of the reflow process is the most important factor to consider. The lead-free alloy solder has a melting point of 217°C. This alloy requires a minimum reflow temperature of 235°C to ensure good wetting. The maximum reflow temperature is in the 245°C to 260°C range, depending on the package size ( |
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