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250R120-R3 Datasheet(PDF) 4 Page - Littelfuse |
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250R120-R3 Datasheet(HTML) 4 Page - Littelfuse |
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4 / 6 page ![]() www.littelfuse.com ©2006 Littelfuse 250R Series Specifications are subject to change without notice. Electronics Designers Guide POLYFUSE® Resettable PTCs Radial Leaded Environmental Specifications Operating/Storage Temperature -40°C to +85°C Maximum Device Surface Temperature in Tripped State 125°C Passive Aging 65°C/85°C, 1000 hours Humidity Aging +85°C, 85%R.H. 1000 hours Thermal Shock MIL-STD-202F Method 107G +125°C to -55°C 10 times Solvent Resistance MIL-STD-202, Method 215F Physical Specifications Lead Material Tin-plated copper Soldering Characteristics Solderability per MIL-STD-202, Method 208E Insulating Material Cured, flame retardant epoxy polymer meets UL94V-0 requirements. Device Labeling Marked with LF, voltage, current rating, and date code. Soldering Parameters - Solder Reflow Condition Reflow Peak Temp/ Duration Time 260°C > 5 Sec > 220°C 30 Sec ~ 60 Sec Preheat 160°C ~ 190°C 60 Sec ~ 90 Sec Storage Condition 0°C~35°C, < 70%RH • Recommended reflow methods: IR, vapor phase oven, hot air oven, N 2 environment for lead-free. • Devices are not designed to be wave soldered to the bottom side of the board. • Devices can be cleaned using standard industry methods and solvents. Note: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Preheating 160 190 220 260 0 30 to 60 Soldering Cooling 120 60 to 90 Time(s) Soldering Parameters - Wave Soldering Condition Wave Soldering Peak Temp/ Duration Time 260°C < 5 Sec > 220°C 2 Sec ~ 20 Sec Preheat 140°C ~ 180°C 180 Sec ~ 210 Sec Storage Condition 0°C~35°C < 70%RH • Recommended soldering methods: heat element oven or N 2 environment for lead-free. • Devices are designed to be wave soldered to the bottom side of the board. • Devices can be cleaned using standard industry methods and solvents. • This profile can be used for lead-free device Note: If soldering temperatures exceed the recommended profile, devices may not meet the performance requirements. Preheating 160 190 220 260 0 2 to 5 Soldering Cooling 20-30 180 to 210 Time(s) |
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