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BYD53G Datasheet(PDF) 2 Page - NXP Semiconductors

Part # BYD53G
Description  Fast soft-recovery controlled avalanche rectifiers
PDF  12 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BYD53G Datasheet(HTML) 2 Page - NXP Semiconductors

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1998 Dec 04
2
Philips Semiconductors
Product specification
Fast soft-recovery controlled
avalanche rectifiers
BYD53 series
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
absorption capability
• Available in ammo-pack.
DESCRIPTION
Cavity free cylindrical glass SOD81
package through Implotec
™(1)
technology. The SOD81 package is
hermetically sealed and fatigue free
as coefficients of expansion of all
used parts are matched.
(1) Implotec is a trademark of Philips.
Fig.1 Simplified outline (SOD81) and symbol.
handbook, 4 columns
a
k
MAM123
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRRM
repetitive peak reverse voltage
BYD53D
−
200
V
BYD53G
−
400
V
BYD53J
−
600
V
BYD53K
−
800
V
BYD53M
−
1000
V
BYD53U
−
1200
V
BYD53V
−
1400
V
VR
continuous reverse voltage
BYD53D
−
200
V
BYD53G
−
400
V
BYD53J
−
600
V
BYD53K
−
800
V
BYD53M
−
1000
V
BYD53U
−
1200
V
BYD53V
−
1400
V
IF(AV)
average forward current
Ttp =55 °C; lead length = 10 mm
see Figs 2 and 3;
averaged over any 20 ms period;
see also Figs 10 and 11
BYD53D to M
−
0.75
A
BYD53U and V
−
0.85
A
IF(AV)
average forward current
Tamb =65 °C; PCB mounting (see
Fig.17); see Figs 4 and 5;
averaged over any 20 ms period;
see also Figs 10 and 11
BYD53D to M
−
0.40
A
BYD53U and V
−
0.45
A
IFRM
repetitive peak forward current
Ttp =55 °C; see Figs 6 and 7
BYD53D to M
−
6.5
A
BYD53U and V
−
8.25
A



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