8

4729I–AUTO–12/06

ATA6661

DRAFT

4.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating

only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this

specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Parameters

Symbol

Min.

Typ.

Max.

Unit

V

S

- Continuous supply voltage

–0.3

+40

V

Wake DC and transient voltage (with 33 k

Ω serial resistor)

- Transient voltage due to ISO7637 (coupling 1 nF)

–40

–150

+40

+100

V

V

Logic pins (RXD, TXD, EN)

–0.3

+6

V

LIN

- DC voltage

- Transient voltage due to ISO7637 (coupling 1 nF)

–40

–150

+60

+100

V

V

INH

- DC voltage

–0.3

+40

V

ESD (DIN EN 61000-4-2)

According LIN EMC Test Specification V1.3

- Pin VS, LIN

- Pin Wake (with 33 k

Ω serial resistor)

–6000

–5000

+6000

+5000

V

V

ESD S5.1 - All pins

–3000

+3000

V

CDM ESD STM 5.3.1-1999 - All pins

FCDM ESD STM 5.3.1- All pins

MM JEDEC A115A - All pins

–500

–1000

–200

+500

+1000

+200

V

V

V

Junction temperature

T

j

–40

+150

°C

Storage temperature

T

stg

–55

+150

°C

Operating ambient temperature

–40

+125

°C

Thermal shutdown

150

165

180

°C

Thermal shutdown hysteresis

5

1020°C

5.

Thermal Resistance

Parameters

Symbol

Value

Unit

Thermal resistance junction ambient

R

thJA

160

K/W