[CSL0902RT1]

　　　　

[Data Sheet]

4-6. Reflow Profile

　 For reflow profile, please refer to the conditions below:(※)

・Meaning of marks, Conditions

4-7. Attention Points in Soldering Operation

4-8. Cleaning after Soldering

　Please follow the conditions below if the cleaning is necessary after soldering.

TL

Reference temperature

230～260

℃

Mark

Meanings

Conditions

Tsmax

Maximum of pre-heating temperature

180

℃

Tsmin

Minimum of pre-heating temperature

140

℃

Ts

Time from Tsmin to Tsmax

Over 60 sec.

tL

Retention time for TL

Within 40 sec.

TP

Peak temperature

260

℃(MAX.)

ITEM

RECOMMENDED CONDITION

　Figure-1

tP

Time for peak temperature

Within 10 sec.

ΔT

R/Δt

Temperature rising rate

Under 3℃/sec.

ΔT

D/Δt

Temperature decreasing rate

Within -3

℃/sec.

※

Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and reflow furnaces before

using, because stress from circuit boards and temperature variations of reflow furnaces vary by customer’s own

conditions.

　This product was developed as a surface mount LED especially suitable for reflow soldering.

So reflow soldering is recommended. Incase of implementing manual soldering,

please take care of following points.

① SOLDER USED

Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu

②HAND SOLDERING CONDITION

LED products do not contain reinforcement material such as a glass fillers.

So thermal stress by soldering greatly influence its reliability.

Please keep following points for manual soldering.

a)

Heating method

Condition ) Temp. of iron top less than

400

℃ within 3 sec.

Heating on PCB pattern, not direct to the

LED. (Fig-1)

b)

Handling after

soldering

Please handle after the part temp.

Goes down to room temp.

Solvent

We recommend to use alcohols solvent such as, isopropyl alcohols

Temperature

Under 30℃ within 3 minutes

Ultrasonic Cleaning

15W／Below 1 liter (capacity of tank)

Drying

Under 100℃ within 3 minutes

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2023.6 - Rev.001

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