RFAM3620

Data Sheet Rev. K, Oct 07, 2021 | Subject to change without notice

4 of 10

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®

Evaluation Board Assembly Drawing

Note:

Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. A via drill diameter of 0.4mm and a

minimum via wall copper plating thickness of 25um is recommended. Open vias are preferred to allow flux and gases to escape during reflow soldering

and therefore to minimize voiding. Underneath this via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete

module DC power (up to 6.1 Watts). In any case the module backside temperature should not exceed 100 °C.

Evaluation Board Schematic

C4

4. 7nF

D2

MM3Z5V6T1

R1

2. 7k

Ω

D3

PTVS13VS1UR

C3

4. 7nF

C5

4. 7nF

C7

DNI

FB1

Bead 60

Ω

T2

RFXF0008

V+

C6

4. 7nF

D4

TQP200002

25V

U1

RFAM3620

C2

4. 7nF

C1

DNI

D1

TQP200002

25V

Power

Enable

At t.

Adjust

GND

C9

4. 7nF

C8

4. 7nF

R2

3. 3k

Ω

C12

4. 7nF

Vt

C10

DNI

C11

DNI

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

17

16

19

18

21

20

1

2

3

4

5

C15

DNI

C16

DNI

C17

0. 3pF

C18

0. 3pF

C13

DNI

C14

DNI

Power

enable

V1 +

At t. Adjust

RF In+

RF In-

RF Out-

RF Out+

DC Out

V2 +

back

side

T1

RFXF0006

2

1

3

4

T3

RFXF0009

3

4

1

2