CLMVC-FKA: PLCC4 3 IN 1 SMD LED

© 2021-2024 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo and the Cree LED logo are registered

trademarks of Cree LED.

CLD-CT1273

REV 14

9

REFLOW SOLDERING

•

The CLMVC-FKA is rated as a MSL 5a product.

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After opening the sealed bag,the SMD LED must be stored under the condition<30ºC and<60%RH. Under these conditions,the SMD LEDs must be

used (subject to reflow) within 24 hours after bag opening, and baking 24-hour/80ºC is required when exceeding 24 hours.

•

Note that baking must only be done once.

•

The temperature profile is as below.

Use only with CLMVC-FKA

Solder

Average ramp-up rate = 4ºC/s max

Preheat temperature = 150ºC ~200ºC

Preheat time = 120s max

Ramp-down rate = 6ºC/s max

Peak temperature = 250ºC max

Time within 5ºC of actual Peak Temperature = 10s max

Duration above 217ºC is 60s max

NOTES

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The packaging sizes of these SMD products are very small and the resin is still soft after solidification. Users are required to handle with care.

Never touch the resin surface of SMD products.

•

To avoid damaging the product’s surface and interior device, it is recommended to choose a special nozzle to pick up the SMD products during the

process of SMT production. If handling is necessary, take special care when picking up these products. The following method is necessary:

Document No.: CREE-05-0057

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pick up SMD products during the process of SMT production . If handling is necessary, it should take more

careful to pick up these products. The following two methods are necessary :

Fig. 1a: For Small Top SMD

Fig. 1b: For Mini side 0.8mm SMD

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For Small Top SMD series , it is recommended to use rubber material Nozzle to pick up SMD products .Two

figure size for reference :

a.) Circular Nozzle: inner diameter: Ø1.8mm+/-0.05mm, outer diameter: Ø2.3mm+/-0.05mm.

b.) Rectangle Nozzle: inner size: 1.3mm x 2.3mm, outer size > SMD size.

6. Electrostatic Discharge and Surge current



Electrostatic discharge (ESD) or surge current (EOS) may damage SMD LED.



Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling of SMD LED.



All devices, equipment and machinery must be properly grounded.



It is recommended to perform electrical test to screen out ESD failures at final inspection.



It is important to eliminate the possibility of surge current during circuitry design

7. Heat Management

Heat management of SMD LED must be taken into consideration during the design stage of SMD LED application. The

current should be de-rated appropriately by referring to the de-rating curve attached on each product specification.

Data is subject to change without prior notice.

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Melting-point

Pre-heat

Soak

Reflow

Cooling

Time

Use all SMD besides LP6-NPP1-01-N1

Solder = Sn63-Pb37

Solder = Lead-free

Average ramp-up rate = 4ºC/s max.

Average ramp-up rate = 4ºC/s max

Preheat temperature = 100ºC ~150ºC

Preheat temperature = 150ºC ~200ºC

Preheat time = 100s max.

Preheat time = 100s max.

Ramp-down rate = 6ºC/s max.

Ramp-down rate = 6ºC/s max.

Peak temperature = 230ºC max.

Peak temperature = 250ºC max.

Time within 5ºC of actual Peak Temperature = 10s max.

Time within 5ºC of actual Peak Temperature = 10s max.

Duration above 183ºC is 80s max.

Duration above 217ºC is 80s max.

Only use LP6-NPP1-01-N1

[13]

Solder = Low Lead-free

Average ramp-up rate = 3ºC/s max.

Preheat temperature = 130ºC ~170ºC

Preheat time = 120s max.

Ramp-down rate = 6ºC/s max.

Peak temperature = 213ºC max.

Time within 3ºC of actual Peak Temperature = 25s max.

Duration above 200ºC is 40s max.

Recommended solder pad design for heat dissipation (2-pin SMD LED):

7.0

2.6

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Recommended solder pad design for heat dissipation (4-pin SMD LED)

Soldering pad:

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