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High Speed CAN Transceiver

Data Sheet

9.0 Package Outline

SOIC-8: Plastic small outline; 8 leads; body width 150 mil; JEDEC: MS-012

NOTES:

1. Maximum die thickness allowable is .015.

2. Dimensioning and tolerances per ANSI.Y14.5M - 1982.

3. “L” is the length of terminal for soldering to a substrate.

4. “N” is the number of terminal positions.

5. Formed leads shall be planar with respect to one another

within .003 inches at seating plane.

6. Country of origin location and ejector pin on package

bottom is optional and depend on assembly location.

7. Controlling dimension: inches.

S

Sy

ym

mb

bo

oll

C

Co

om

mm

mo

on

n D

Diim

me

en

ns

siio

on

ns

s

N

No

otte

e

M

Miin

n..

N

No

om

m..

M

Ma

ax

x..

A

.061

.064

.068

.004

.006

0.010

.055

.058

.061

B

.0138

.061

.020

C

.0075

.008

.0098

D

See Variations

1

E

.150

.155

.157

e

.050 BSC

H

.230

.236

.244

h

.010

.013

.016

L

.016

.025

.035

N

See Variations

2

a°

0°

5°

8°

V

Va

arriia

attiio

on

ns

s

1

1

2

2

D

D

N

N

N

No

otte

e

M

Miin

n..

N

No

om

m..

M

Ma

ax

x..

AA

.189

.194

.196

8

AB

.337

.342

.344

14

AC

.386

.391

.393

16