CS4341

DS298F5

33

8.2

TSSOP

Notes: 1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold

mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per

side.

2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be

0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not

reduce dimension “b” by more than 0.07 mm at least material condition.

3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.

9. PACKAGE THERMAL RESISTANCE

INCHES

MILLIMETERS

NOTE

DIM

MIN

NOM

MAX

MIN

NOM

MAX

A

--

--

0.043

--

--

1.10

A1

0.002

0.004

0.006

0.05

--

0.15

A2

0.03346

0.0354

0.037

0.85

0.90

0.95

b

0.00748

0.0096

0.012

0.19

0.245

0.30

2,3

D

0.193

0.1969

0.201

4.90

5.00

5.10

1

E

0.248

0.2519

0.256

6.30

6.40

6.50

E1

0.169

0.1732

0.177

4.30

4.40

4.50

1

e

--

0.026 BSC

--

--

0.65 BSC

--

L

0.020

0.024

0.028

0.50

0.60

0.70

∝

0°

4°

8°

0°

4°

8°

JEDEC #: MO-153

Controlling Dimension is Millimeters

Package

Symbol

Min

Typ

Max

Units

SOIC

(for multi-layer boards)

TSSOP

(for multi-layer boards)

-

-

74

89

-

-

°C/Watt

°C/Watt

16L TSSOP (4.4 mm BODY) PACKAGE DRAWING

E

N

1 23

e

A1

A2

A

D

SEATING

PLANE

L

SIDE VIEW

END VIEW

TOP VIEW

∝