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MP86950GLVT Datasheet(PDF) 4 Page - Monolithic Power Systems

Part # MP86950GLVT
Description  Intelli-Phase TM Solution, Monolithic Half-Bridge with Integrated Internal Power MOSFETs and Gate Drivers
PDF  15 Pages
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP86950GLVT Datasheet(HTML) 4 Page - Monolithic Power Systems

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MP86950
– INTELLI-PHASETM SOLUTION
W/ INTEGRATED MOSFETS AND DRIVERS
MP86950 Rev. 1.0
www.MonolithicPower.com
4
12/18/2020
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2020 MPS. All Rights Reserved.
ABSOLUTE MAXIMUM RATINGS (1)
Supply voltage (VIN) ..................................... 18V
VSW (DC)................................ -0.3V to VIN + 0.3V
VSW (25ns) ........................................-5V to +25V
VIN - VPHASE (DC) .........................-0.3V to +25V
VIN - VPHASE (10ns)...........................-5V to +32V
VBST - VPHASE (25ns)....................................... 5V
VBST ................................................. VPHASE + 4V
VDD, VDRV ....................................-0.3V to +4V
All other pins .................... -0.3V to VDD + 0.3V
Instantaneous current ................................. 90A
Junction temperature ...............................150°C
Lead temperature .....................................260°C
Storage temperature ............... -65°C to +150°C
ESD Ratings
Human body model (HBM) ................ Class 1C
Charged device model (CDM) .......... Class C2B
Recommended Operating Conditions (2)
Supply voltage (VIN) .........................4.5V to 16V
Driver voltage (VDRV) .......................3.0V to 3.6V
Logic voltage (VDD)..........................3.0V to 3.6V
Operating junction temp (TJ) .... -40°C to +125°C
Thermal Resistance (3) (4) θJB
θJC_TOP
TLGA-27 (4mmx5mm) ........ 3.1...... 9.1....°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The device is not guaranteed to function outside of its
operating conditions.
3)
θ
JB is the thermal resistance from the junction to the board
around the PGND soldering point.
4)
θ
JC_TOP is the thermal resistance from the junction to the top of
the package.



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