Application

GPU

GPU

AI

GPU

Large Interposer

2.5D

Stacked Substrate

(Cost Effective 2.5D)

Configuration

ASIC + HBM

ASIC + 4HBM

ASIC + 6HBM

ASIC + 6HBM

2ASIC + 8HBM

ASIC + 6HBM

Pkg

41 x 31 mm

55 x 55 mm

55 x 55 mm

55 x 58 mm

85 x 85 mm

55 x 55 ABF

85 x 85 HDI

Interposer

27 x 15 mm

43 x 34 mm

43 x 37 mm

47 x 34 mm

54 x 46 mm

45 x 34 mm

ASIC

17 x 33 mm

32 x 26 mm

33 x 26 mm

33 x 26 mm

85 x 85 mm

32 x 24 mm

Si Node

14 nm

12 nm

7 nm

5 nm

TV

TV

Memory

HBM2

HBM2

HBM2

HBM2E/3

HBM2E TV

HBM2E TV

Status

LVM 2019

HVM 2019

HVM 2020

HVM 2023

Internally Qualified

2022

Customer Qualified

Floor Plan

HDI Substrate

ABF Substrate

Substrate

Si Interposer

Logic

Memory/

Small Logic

Through Silicon Via (TSV)

2.5D TSV Platform

Examples of 2.5D TSV products are shown to

demonstrate Amkor’s production capabilities.

f

Advanced assembly technology

▷ Micro-Cu pillar bumping of functional die

▷ Chip on Wafer (CoW) flip chip attach of

functional die

▷ 300 mm interposer wafer molding

▷ Molded wafer backgrinding

▷ Large, molded CoW module attach to organic

substrate

▷ 25-60 mm FCBGA body sizes for 2.5D TSV

assembly integration

▷ Bare die (with stiffener), lidded and overmolded

final assembly options available

▷ Intermediate electrical test for partially

assembled modules (if customer design allows)

f

Advanced TSV wafer finishing

▷ Frontside and backside interposer wafer

bumping

▷ 40 μm pitch Cu pillar and landing pad

micro-bumps

f

Backside Cu redistribution qualified for the 2.5D TSV

platform