STA5620 datasheet(25/29 Pages) STMICROELECTRONICS

25 / 29 page

STA5620

Package information

25/29

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 6.

VFQFPN 32L (5x5x1.0mm) mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

0.800

0.900

1.000

0.031

0.035

0.039

0.800

0.900

1.000 0.0315 0.0354 0.0394

0.020

0.050

0.0008 0.0020

0.200

0.0079

0.180

0.250

0.300 0.0071 0.0098 0.0118

4.850

5.000

5.150 0.1909 0.1969 0.2028

3.500

3.600

3.700 0.1378 0.1417 0.1457

4.850

5.000

5.150 0.1909 0.1969 0.2028

3.500

3.600

3.700 0.1378 0.1417 0.1457

0.500

0.0197

0.300

0.400

0.500 0.0118 0.0157 0.0197

ddd

0.050

0.0020

VFQFPN32 (5x5x1.0mm)

Very Fine Quad Flat Package No lead

7376875 F

STA5620 Datasheet(PDF) 25 Page - STMicroelectronics

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