STPS1L20MF

Package information

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Package information

Figure 12.

STmite flat recommended footprint (all dimensions in mm)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 4.

STmite flat dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

0.80

0.85

0.95

0.031 0.033 0.037

b

0.40

0.55

0.65

0.016 0.022 0.026

b2

0.70

0.85

1.00

0.027 0.033 0.039

c

0.10

0.15

0.25

0.004 0.006 0.009

D

1.75

1.90

2.05

0.069 0.075 0.081

E

3.60

3.80

3.90

0.142 0.150 0.154

E1

2.80

2.95

3.10

0.110 0.116 0.122

L

0.50

0.55

0.80

0.020 0.022 0.031

L1

2.10

2.40

2.60

0.083 0.094 0.102

L2

0.45

0.60

0.75

0.018 0.024 0.030

L3

0.20

0.35

0.50

0.008 0.014 0.020

E1

E

c

Db

L3

A

L

L1

L2

b2

0.85 0.63

2.00

4.13

0.95

1.95

0.65

0.65