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M25P40 Datasheet(PDF) 51 Page - STMicroelectronics

Part # M25P40
Description  4 Mbit, low voltage, serial Flash memory with 50 MHz SPI bus interface
PDF  53 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M25P40 Datasheet(HTML) 51 Page - STMicroelectronics

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M25P40
Revision history
51/53
24-Oct-2005
7.0
50 MHz operation added (see Table 20: AC characteristics (50 MHz
operation, device grade 6, VCC min = 2.7 V)). All packages are
ECOPACK®. Blank option removed from under Plating technology in
Table 24: Ordering information scheme. MLP package renamed as
VFQFPN, silhouette and package mechanical drawing updated (see on
page 1 and Figure 27: VFQFPN8 (MLP8) 8-lead Very thin Fine pitch
Quad Flat Package No lead, 6 × 5 mm, package outline.
22-Dec-2005
8.0
Note 2 added below Figure 26 and note 1 added below Figure 27
tRES1 and tRES2 modified in Table 20: AC characteristics (50 MHz
operation, device grade 6, VCC min = 2.7 V).
Read Identification (RDID) added. Titles of Figure 27 and Table 23
corrected.
14-Apr-2006
9
The data contained in Table 11, Table 16 and Table 19 is no longer
preliminary data.
Figure 3: Bus Master and memory devices on the SPI bus modified and
Note 2 added.
40 MHz frequency condition modified for ICC3 in Table 14: DC
characteristics (device grade 3).
Table 16: Instruction times (device grade 3) shows preliminary data.
Condition changed for the Data Retention parameter in Table 11: Data
retention and endurance. VWI parameter for device grade 3 added to
Table 8: Power-up timing and VWI threshold.
SO8 package specifications updated (see Figure 26 and Table 22).
/X Process added to Table 24: Ordering information scheme.
05-Jun-2006
10
tRES1 and tRES2 parameter timings changed for devices produced with the
“X” process technology in Table 19 and Table 19.
SO8 Narrow package specifications updated (see Figure 26 and
Table 22).
18-Dec-2006
11
Hardware Write Protection feature added on page 1. Small text changes.
Section 2.7: VCC supply voltage and Section 2.8: VSS ground added.
Figure 3: Bus Master and memory devices on the SPI bus modified,
note 2 removed and replaced by explanatory paragraph.
WIP bit behavior specified at Power-up in Section 7: Power-up and
Power-down. TLEAD added to Table 9: Absolute maximum ratings and VIO
max modified.
VFQFPN8 package specifications updated (see Table 23 and Figure 27).
25-Jan-2007
12
VCC voltage range from W17 2007 is extended to 2.3 V to 3.6 V.
Table 21: AC characteristics (33 MHz operation, device grade 6, VCCmin
=2.3 V) added.
Table 18: Which AC characteristics to use? added. AC characteristics at
40 MHz removed.
Table 25.
Document revision history (continued)
Date
Revision
Changes



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