CPC1908 datasheet(3/6 Pages) CLARE

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CPC1908

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R05

Parameter

Conditions

Symbol

Min

Typ

Max

Units

Thermal Resistance (junction to case)

RθJC

0.35

°C/W

Thermal Resistance (junction to ambient)

Free air

RθJA

°C/W

Junction Temperature (operation)

-40

100

°C

Thermal Characteristics

Thermal Management

Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal

interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate

junction-to-ambient thermal resistance of 12.5°C/W.

Heat Sink Calculation

Higher load currents are possible by using lower thermal resistance heat sink combinations.

θCA =

J - TA) IL(99)

•

θJC

- R

θJC

J = Junction Temperature (°C), TJ ≤ 100°C *

A = Ambient Temperature (°C)

L(99) = Load Current with Case Temperature @ 99°C (Arms)

L = Desired Operating Load Current (Arms), IL ≤ IL(MAX)

θJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W

θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)

* Elevated junction temperature reduces semiconductor lifetime.

Heat Sink Rating

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