CF5072BA

SEIKO NPC CORPORATION —4

PAD LAYOUT

(Unit:

µm)

PAD DESCRIPTION AND DIMENSIONS

Chip size: 1.82

× 1.00mm

Chip thickness: 300 ± 30µm

Pad size: 110

× 100µm (TEST pin only = 90 × 90µm)

Pad No.

Name

I/O

Function

Pad dimensions [µm]

Pad size [µm]

XYXY

1

VSS1

–

Oscillator ground

125

135

110

100

2

TEST

I

IC test pin (leave open circuit for normal operation)

1283

160

90

90

3

OE

I

Output enable, with pull-up resistor built-in

1695

135

110

100

4

VSS2

–

Ground

1695

268

110

100

5

OUT

O

Differential PECL non-inverting output (true)

1695

460

110

100

6

OUTN

O

Differential PECL inverting output (complementary)

1695

673

110

100

7

VDD1

–

ECL buffer supply

1695

865

110

100

8

VDD2

–

Supply

643

865

100

110

9

XIN

I

Crystal unit connection

125

828

110

100

10

XC

I

Varicap anode connection

125

708

110

100

11

NC

–

No connection

125

495

110

100

12

1. The XR pin electrostatic withstand voltage is weaker than the other pins. The electrostatic withstand voltage of pins, excluding XR, is the same as that

for existing NPC devices.

I

Varicap cathode connection and inductor connection

125

375

110

100

13

VC

I

Control voltage pin

125

255

110

100

(1820,1000)

XIN

1

13

12

11

10

9

6

7

8

3

4

5

2

XC

NC

XR

VC

VSS1

VDD2

TEST

VDD1

OUTN

OUT

VSS2

OE

(0,0)

X

Y