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TB62802FG Datasheet(PDF) 6 Page - Toshiba Semiconductor |
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TB62802FG Datasheet(HTML) 6 Page - Toshiba Semiconductor |
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6 / 20 page ![]() TB62802FG 2006-06-14 6 AC Characteristics (input transition rise or fall time: tr/tf = 3.0 ns) Ta = 25°C, VCC = 5.0 V Ta = 0 to 60°C VCC = 4.7 to 5.5 V Characteristic Symbol Test Condition Min Typ. Max Min Max Unit Reference Measurement Diagram tpLH ( φ) 5.3 10.8 15.5 5.0 16.0 tpHL ( φ) CL = 250 pF 5.3 9.8 15.5 5.0 16.0 Measurement diagram 1 tpLH (O) 2.5 5.4 9.5 2.0 10.0 Propagation delay time tpHL (O) CL = 20 pF 2.5 6.0 10.5 2.0 12.0 ns Measurement diagram 2 tpCLH ( φ) 9.5 14.0 24.0 9.0 25.0 tpCHL ( φ) CL = 250 pF 9.5 15.4 24.0 9.0 25.0 Measurement diagram 1 tpCLH (O) 7.2 10.7 19.0 6.0 23.0 Output OFF time tpCHL (O) CL = 20 pF 7.3 18.5 30.0 6.0 35.0 ns Measurement diagram 2 Light load drive output skew to (skw) CL = 20 pF 0 ⎯ 2.0 0 2.0 ns Measurement diagram 3 Heavy load drive output crosspoints VT (crs) CL = 100 to 250 pF 1.5 ⎯ ⎯ 1.5 ⎯ V Measurement diagram 4 CPD ( φ) ⎯ 57 ⎯ ⎯ ⎯ Equivalent internal capacitance (Note 1) CPD (O) ⎯ 18 ⎯ ⎯ ⎯ pF Note 1: CPD denotes “power dissipation capacitance”. Dynamic power dissipation can be calculated using the CPD value. Pd = Σ [CPD × VCC 2 × Fin] + Σ (CL × V CC 2 × Fout) CL: Load capacitance per output CPD: Power dissipation capacitance Fin: Input clock frequency Fout: Output clock frequency For example: For heavy load drive output, driving a load capacity of 250 pF at 25 MHz; For light load drive output, driving a load capacity of 20 pF at 25 MHz. Note 2: In practice, the frequencies of some shift gate control signals are lower than the transfer clock. Therefore the power dissipation during practical use is smaller than the calculated value below. Pd = [57 pF × 5.0 V × 5.0 V × 25 MHz] × 4 bit + (250 pF × 5.0 V × 5.0 V × 25 MHz) × 4 bit + [18 pF × 5.0 V × 5.0 V × 25 MHz] × 4 bit + (20 pF × 5.0 V × 5.0 V × 25 MHz) × 4 bit ∼− 862 mW The typical power dissipation is approximately 862 mW. Notes on System Design As shown above, the TB62802FG consumes high current while operating. There is temporary flow of a current greater than the calculated value. To suppress bouncing from the power supply and GND, decoupling for the power supply is a vital necessity. Below is an example of how the capacitance of a decoupling capacitor is calculated. Be sure to refer to this when designing a system. The decoupling capacitor should be placed underneath the IC to reduce the high-frequency components. Supply current variable: 350 mA (estimated variable in 1 bit) Supply voltage variable: 0.3 V Noise pulse width: 10 ns (time in which fluctuation occurs) C = ∆ICC/(∆V/∆T) = 350 mA × 4 bit/(0.3 V/10 ns) ∼− 47 nF ∼− 0.047 µF (when using a normal capacitor) To control the fluctuation in the low-frequency components, it is recommended that the power supply on the board be decoupled using a 10 µF to 50 µF capacitor. |
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