24C64RP datasheet(33/38 Pages) STMICROELECTRONICS

33 / 38 page

M24128, M24C64, M24C32

Part numbering

33/38

Part numbering

For a list of available options (speed, package, etc.) or for further information on any aspect

of this device, please contact your nearest ST sales office.

The category of second-level interconnect is marked on the package and on the inner box

label, in compliance with JEDEC Standard JESD97. The maximum ratings related to

soldering conditions are also marked on the inner box label.

Table 23.

Ordering information scheme

Example:

M24C32–

W MN 6

P /C

Device type

M24 = I2C serial access EEPROM

Device function

128–B = 128 Kbit (16384 x 8)

C64– = 64 Kbit (8192 x 8)

C32– = 32 Kbit (4096 x 8)

Operating voltage

W = VCC = 2.5 V to 5.5 V

R = VCC = 1.8 V to 5.5 V

F = VCC = 1.7 V to 5.5 V

Package

BN = PDIP8

MN = SO8 (150 mil width)

DW = TSSOP8 (169 mil width)

MB = UFDFPN8 (MLP8)

Device grade

6 = Industrial: device tested with standard test flow over –40 to 85 °C

3 = Automotive: device tested with high reliability certified flow(1) over –40 to 125°C.

ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment.

The high reliability certified flow (HRCF) is described in the quality note QNEE9801. Please ask your

nearest ST sales office for a copy.

5 = Consumer: device tested with standard test flow over –20 to 85°C

Option

blank = Standard Packing

T = Tape and Reel Packing

Plating technology

blank = Standard SnPb plating

P or G = ECOPACK® (RoHS compliant)

Process

P = F6DP26% Chartered

C = F6DP26% AmMokio

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