Data Sheet

ADPL42005

analog.com

Rev. 0

6 of 26

ABSOLUTE MAXIMUM RATINGS

Table 3. Absolute Maximum Ratings

PARAMETER

RATING

VIN to GND

−0.3V to +22V

VOUT to GND

−0.3V to +20V

EN/UVLO to GND

−0.3V to VIN

PG to GND

−0.3V to VIN

SENSE/ADJ to GND

−0.3V to VOUT

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature

Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product.

This is a stress rating only; functional operation of the product at these or any other conditions above those indicated

in the operational section of this specification is not implied. Operation beyond the maximum operating conditions

for extended periods may affect product reliability.

Thermal Data

Absolute maximum ratings apply individually only, not in combination. The ADPL42005 can be damaged when the

junction temperature limit is exceeded. Monitoring ambient temperature does not guarantee that TJ is within the

specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum

ambient temperature may have to be derated.

In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient

temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The

junction temperature (TJ ) of the device is dependent on the ambient temperature (TA), power dissipation of the

device (PD), and junction-to-ambient thermal resistance of the package (θJA).

The maximum junction temperature (TJ ) is calculated from the ambient temperature (TA) and power dissipation (PD)

using the formula:

ΤJ = ΤA + (ΡD × θJA) (1)

The junction-to-ambient thermal resistance (θJA) of the package is based on modeling and calculation using a four-

layer board. The junction-to-ambient thermal resistance is highly dependent on the application and board layout. In

applications where high maximum power dissipation exists, close attention to thermal board design is required. The

value of θJA may vary, depending on PCB material, layout, and environmental conditions. The specified values of θJA

are based on a four-layer, 4 in. × 3 in. circuit board. Refer to JESD51-7 and JESD51-9 for detailed information on the

board construction. For additional information, refer to the AN-617 application note.

ΨJB is the junction-to-board thermal characterization parameter with units of °C/W. The package’s ΨJB is based on

modeling and calculation using a four-layer board. The JESD51-12, Guidelines for Reporting and Using Electronic

Package Thermal Information, states that thermal characterization parameters are not the same as thermal