RFAM3790

Data Sheet Rev.D, Oct 07, 2021 | Subject to change without notice

4 of 8

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®

Evaluation Board Assembly Drawing

Note:

Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. A via drill diameter of 0.4mm and a

minimum via wall copper plating thickness of 25um is recommended. Open vias are preferred to allow flux and gases to escape during reflow soldering

and therefore to minimize voiding. Underneath this via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete

module DC power (up to 5 Watts). In any case the module backside temperature should not exceed 110 °C.

Evaluation Board Schematic

C4

4.7nF

C2

4.7nF

C1

DNI

D2

MM3Z5V6T1

R1

2.7k

Ω

D3

TGL34-33A

C3

4.7nF

C5

4.7nF

C7

DNI

D1

TQP200002

25V

FB1

Bead 60

Ω

T1

RFXF0006

T2

RFXF0008

V+

RF INPUT

RF OUTPUT

1

2

3

4

5

6

7

8

9

C6

4.7nF

Power

Enable

Att.

Adjust

GND

U1

RFAM3790

C9

4.7nF

C8

4.7nF

D4

TQP200002

25V

T3

RFXF0009

D1

D4

D3

D2

EVALUATION-BOARD RFAM2790 ED A533

C4

C8

R1

C7

C1

C2

C3

C6

Fb1

C5

C9

TR3

TR2

TR1

ADJUST

J1

J2

V+

POWER

ENABLE

ATT

GND

RF_OUT

RF_IN

RFAM3790PCBA-410