Rev. 0 2010-07-15

SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIEFIER

MB2M ~ MB10M

www.meisemi.com

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Single Phase Glass Passivated Bridge Rectifier

Features

 UL recognized under File #E197450

 Glass passivated chip junction

 High forward surge current capability

 High temperature soldering guaranteed:

260℃/10 seconds

 RoHS and REACH Compliance

Mechanical Data

Case:

Transfer molded plastic

Polarity

Polarity symbols marked on case

Terminals:

Plated Leads solderable per MIL-STD-750 method 2026

Mounting torque

/

Mounting position:

Any

Weight:

0.0078 ounce, 0.22 gram

Maximum Ratings (T Ambient=25ºC unless noted otherwise)

Symbol

Description

MB2M

MB4M

MB6M

MB8M

MB10M

Unit

Conditions

VRRM

Max Recurrent Peak Reverse Voltage

200

400

600

800

1000

V

VRMS

Max RMS Voltage

140

280

420

560

700

V

VDC

Max DC Blocking Voltage

200

400

600

800

1000

V

I(AV)

Max Average Forward Rectified Current

0.5/0.8

A

@TA=30℃

On Glass-epoxy PCB (note1)

On Aluminum substrate

(Note2)

IFSM

Peak Forward Surge Current

30

A

8.3ms single half sine-wave

(JEDEC method)

TJ,TSTG

Operating and Storage Temperature Range

-55 to +150

℃

I2t

Rating for Fusing

5

A2s

T<8.3mS

Electrical Characteristics (T Ambient=25ºC unless noted otherwise)

Symbol

Description

MB2M

MB4M

MB6M

MB8M

MB10M

Unit

Conditions

VF

Max Instantaneous

Forward Voltage

1.00

V

Drop per Bridge

element 0.4A

IR

Max DC Reverse Current

at Rated DC Blocking

Voltage

5.0

μA

TA=25℃

100

Tc=125℃

Rθ-Ja

Typical Thermal

Resistance

85

℃/W

Note 1

CJ

Typical Junction

capacitance per leg

13

pF

Measured at

1.0MHz/4.0V

Note:

1． On glass epoxy PCB mounted on 0.05” x 0.05” (1.3mm x 1.3mm) copper pads

2． Ohn aluminum substrage PCB with an area of 0.8” x 0.8” x 0.25” (20mm x 20mm x 6.4mm) mounted on 0.05” x 0.05” (1.3mm x

1.3mm) solder pad