UCC2913

UCC3913

SLUS274A – JANUARY 1999 – REVISED APRIL 2003

2

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

TA

PACKAGE(1)

PART NUMBER

40

°Cto85°C

PDIP (N)

UCC2913N

–40

°C to 85°C

SOIC (D)

UCC2913D

0

°Cto70°C

PDIP (N)

UCC3913N

–0

°C to 70°C

SOIC (D)

UCC3913D

(1) The N and D packaged are also available taped and reeled.

Add an R suffix to the device type (i.e., UCC2913NR).

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

UCC2923

UCC3913

UNIT

Input voltage

IMAX

limited to VDD

V

VDD

50

Input current

SHUTDOWN

10

mA

In ut current

PL

10

mA

Operating junction temperature range, TJ

–55 to 150

Storage temperature, Tstg

–65 to 150

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

C

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is

not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to

VSS (the most negative voltage). All currents are positive into and negative out of the specified terminal.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Input current, IVDD

2

5

20

mA

1

2

3

4

8

7

6

5

SD/FLT

IMAX

VDD

CT

PL

OUT

SENSE

VSS

1

2

3

4

8

7

6

5

SD/FLT

IMAX

VDD

CT

PL

OUT

SENSE

VSS

N PACKAGE

(TOP VIEW)

D PACKAGE

(TOP VIEW)