STANDARD APPLICATION

MarginDown

MarginUp

VI

C

330 F

(Optional)

O

m

C

560 F

Electrolytic

(Required)

I

m

Inhibit

GND

GND

VO

V Sense

O

Track

RSET

PTH12030x

(TopView)

1

3

13 12 11

9

7

6

5

4

2

10

8

L

O

A

D

ABSOLUTE MAXIMUM RATINGS

PTH12030W/L

SLTS211H – MAY 2003 – REVISED DECEMBER 2008 .................................................................................................................................................... www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

A.

RSET = Required to set the output voltage to a value higher than the minimum value. See the Application Information

section for values.

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see

the TI website at www.ti.com.

Over operating free-air temperature range, all voltages are with respect to GND (unless otherwise noted)

MIN

TYP

MAX

UNIT

VTrack

Track pin voltage

–0.3

VI + 0.3

V

TA

Operating Temperature

Over VI range

–40

85

Range

Twave

Wave solder temperature

Surface temperature of module body or pins

PTH12030WAH

260

(5seconds maximum)

PTH12030WAD

°C

PTH12030WAS

235 (1)

Treflow

Solder reflow temperature

Surface temperature of module body or pins

PTH12030WAZ

260 (1)

Tstg

Storage Temperature

Storage temperature of module removed from shipping package

–55

125

Tpkg

Packaging temperature

Shipping Tray or Tape and Reel storage or bake temperature

45

Mechanical Shock

Per Mil-STD-883D, Method 2002.3, 1 ms, 1/2 Sine, mounted

500

G

Mechanical Vibration

Mil-STD-883D, Method 2007.2 20-2000 Hz

15

G

Weight

10

grams

Flammability

Meets UL 94V-O

(1)

During soldering of package version, do not elevate peak temperature of the module, pins, or internal components above the stated

maximum.

2

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