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ADC101S021CISDX/NOPB Datasheet(PDF) 4 Page - Texas Instruments |
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ADC101S021CISDX/NOPB Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 25 page ![]() ADC101S021 SNAS307G – JULY 2005 – REVISED JANUARY 2014 www.ti.com Package Thermal Resistance Package θJA 6-lead WSON 94°C / W 6-lead SOT-23 265°C / W Soldering process must comply with Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.(1) (1) Reflow temperature profiles are different for lead-free and non-lead-free packages. 4 Submit Documentation Feedback Copyright © 2005–2014, Texas Instruments Incorporated Product Folder Links: ADC101S021 |
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