5 Specifications

5.1 Absolute Maximum Ratings(1)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

7

V

IIK

Input diode current

For VI < –0.5 V or VI > VCC + 0.5 V

± 20

mA

IO

Drain current, per output

For –0.5 V < VO < VCC + 0.5 V

± 25

mA

IOK

Output diode current

For VO < –0.5 V or VO > VCC + 0.5 V

± 20

mA

IO

Output source or sink current per output pin

For VO > –0.5 V or VO < VCC + 0.5 V

± 25

mA

ICC

Continuous current through VCC or GND

± 50

mA

TJ

Junction temperature

±150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating

and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not

implied.

5.2 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage range

HC types

2

6

V

HCT types

4.5

5.5

VI, VO

Input or output voltage

0

VCC

V

tt

Input rise and fall time

2 V

1000

ns

4.5 V

500

6 V

400

TA

Temperature range

–55

125

℃

5.3 Thermal Information

THERMAL METRIC

D (SOIC)

N (PDIP)

UNIT

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

(1)

138.7

91

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

93.8

78.9

°C/W

RθJB

Junction-to-board thermal resistance

94.7

70.7

°C/W

ψJT

Junction-to-top characterization parameter

49.1

58.6

°C/W

ψJB

Junction-to-board characterization parameter

resistance

94.3

70.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

CD54HC73, CD74HC73, CD74HCT73

SCHS134G – FEBRUARY 1998 – REVISED OCTOBER 2022

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